Substrate processing apparatus
US10049906B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 3, 2017 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jan 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate processing apparatus, which comprises a processing chamber, a substrate sensing assembly, a rotation shaft and a driving assembly. A portion of the rotation shaft is provided inside the processing chamber and the remaining portion thereof is provided outside the processing chamber. The substrate sensing assembly is provided on the portion of the rotation shaft outside the processing chamber. The driving assembly is fixed at the portion of the rotation shaft inside the processing chamber. The driving assembly drives, when coming into contact with the substrate, the rotation shaft to rotate about its own axis along a first direction, and drives, when the substrate comes into no contact with the driving assembly, the rotation shaft to rotate about its axis along a second direction opposite to the first direction. The treatment liquid does not affect the substrate sensing assembly since it is provided outside the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.