Thermal interface pad material with perforated liner
US10049959B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2012 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Oct 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.