Encapsulation composition (as amended)
US10050204B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2014 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jul 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.