Encapsulation of an organic optoelectronic component
US10050229B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 8, 2015 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Jul 8, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated device comprises: an organic optoelectronic component exhibiting at least one sensitive surface protected from oxygen and/or water vapor; and a multilayer encapsulation structure covering the sensitive surface, comprising at least one layer made of organic material interposed between first and second barrier layers made of nonmetallic inorganic material impermeable to oxygen and water vapor; wherein the barrier layers are made of a material chosen from a stoichiometric metal oxide, stoichiometric silicon oxide and a silicon oxynitride and produced by atomic layer deposition, and wherein the multilayer encapsulation structure also comprises at least one active layer containing a nonstoichiometric oxide exhibiting an oxygen deficiency, also interposed between the first and said second barrier layers. A process for encapsulating a component exhibiting a “sensitive” surface protected from oxygen and/or water vapor by producing a multilayer encapsulation structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.