Coefficient of thermal expansion (CTE) matched transistor outline (TO) header
US10050410B2 · kind B2 · utility
2Cited by
1References
20Claims
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Key dates
| Filing date | Feb 15, 2017 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Feb 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02492
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.