Infrared detector array with selectable pixel binning systems and methods
US10051210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2015 |
| Grant date | Aug 14, 2018 |
| Priority date | — |
| Expiry date | Oct 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.