Bonding apparatus and method
US10052237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2014 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | May 8, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll having three or more pattern elements protruding radially outward, wherein each pattern element includes a pattern surface. The pattern surfaces are also separated from each other by gaps having minimum widths. The pattern roll may be adjacent an anvil roll to define a nip between the pattern surfaces and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surfaces and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surfaces to form a discrete bond region between the substrates. During the bonding process, some of yielded substrate material also flows from under the pattern surfaces and into the gaps to form gap grommet regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.