Method of manufacturing a component
US10052712B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2014 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Dec 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12389
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of manufacturing and measuring the geometry of at least a part of a component, and a method of manufacturing a component, both include providing a powder layer to a melt region; selectively melting the powder layer using an energy source, the melted powder subsequently solidifying to form a solid layer; scanning the melt region, including the solid layer, using a scanning electron beam; detecting backscattered electrons resulting from the interaction of the scanning electron beam with the melt region; determining the geometry of the solid layer from the detected backscattered electrons; and storing data relating to the determined geometry of the solid layer. The methods may also include adjusting parameters of the steps of providing a powder layer and/or selectively melting the powder layer to avoid future recurring errors, or generating a virtual 3-D model of the manufactured component, using the stored data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.