Bonding method and bonded structure
US10052713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Sep 8, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/407
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding target member 1 having a solid bonding material 3 with aluminum as a main component is interposed between a metal member 2 and a ceramic member 4 and an elastic member 12 are pressurized by a pressurizing section 13 and a bonding tool section 15 of a resonator 14 in a vertical direction. The bonding tool section 15 of the resonator 14 resonates with sound vibration or ultrasound vibration transmitted from an oscillator 16. An interfacial portion between the metal member 2 and the bonding material 3 with aluminum as a main component and an interfacial portion between the bonding material 3 with aluminum as a main component and the ceramic member 4 each receive pressurization and vibration energy to be bonded together. The metal member 2 and the ceramic member 4 can be bonded together at ordinary temperature in the atmosphere with the bonding material 3 with aluminum as a main component. When the ceramic member 4 has a thickness resistant to pressurization and vibration energy at the time of bonding to resist crack, the elastic member 12 may be disposed on a metal member 2 side, or may not be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.