Ethylene-vinylalcohol resin composition, molded product, and multilayer structure
US10053551B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
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Key dates
| Filing date | Apr 24, 2015 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/0861
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition containing an ethylene-vinylalcohol copolymer (A) and a hydroxyl group containing compound (B), the hydroxyl group containing compound (B) having a molecular weight of 200 or less, a ratio of the number of hydroxyl groups in one molecule relative to the molecular weight within a range of 0.02-0.03, and a melting point of 23° C. or higher, the content of the hydroxyl group containing compound (B) being 3-15 mass % relative to the resin composition, a molded product using the same, and a multilayer structure including a layer composed of the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.