Conductive film-forming composition and conductive film producing method
US10053587B2 · kind B2 · utility
1Cited by
1References
17Claims
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Key dates
| Filing date | Jul 23, 2015 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Dec 3, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
In a conductive film-forming composition including copper oxide particles, water and a dispersant selected from the group consisting of a water-soluble polymer and a surfactant, the copper oxide particles have a volume average secondary particle size of 20 to 240 nm, and the copper oxide particles are contained in an amount of 10 to 70 wt % with respect to a total weight of the conductive film-forming composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.