Thermosiphon with integrated components
US10054371B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Feb 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.