Patent · US Active

Method for fabricating a magnetic sensor assembly

US10054649B2 · kind B2 · utility

3Cited by

17References

16Claims

0Family size

Assignee

Seagate Technology LLC · US

Inventors

Eric W. Singleton · Pretoria, ZA
Qing He · Plymouth, US
Jae-Young Yi · Prior Lake, US
Matt Johnson · Mountain Lake, US
Zheng Gao · San Jose, US
Dimitar V. Dimitrov · Edina, US
Song S. Xue · Morristown, US

Key dates

Filing date	Aug 16, 2016
Grant date	Aug 21, 2018
Priority date	—
Expiry date	Feb 25, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB82Y25/00
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A magnetic sensor assembly includes first and second shields each comprised of a magnetic material. The first and second shields define a physical shield-to-shield spacing. A sensor stack is disposed between the first and second shields and includes a seed layer adjacent the first shield, a cap layer adjacent the second shield, and a magnetic sensor between the seed layer and the cap layer. At least a portion of the seed layer and/or the cap layer comprises a magnetic material to provide an effective shield-to-shield spacing of the magnetic sensor assembly that is less than the physical shield-to-shield spacing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.