Optical chip-scale package for use in a high channel density, high data rate data communications system having optical input/output (I/O) ports
US10054749B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical chip-scale package (CSP) is provided for use in a high channel density, high data rate communications system that has optical I/O ports and that is capable of being housed in a standard rackmount-sized box. The optical I/O ports comprise a bulkhead of multi-optical fiber (MF) adapters installed in a front panel of a switch box that houses the communications system. The adapters have first and second receptacles that are adapted to mate with first and second MF connectors, respectively. The communications system comprises a single-harness optical subassembly that uses a plurality of the optical CSPs that interface with a switch IC chip of the communications system to perform electrical-to-optical and optical-to-electrical conversion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.