Methods and apparatus for collocating electromagnetic coils and electronic circuits
US10056186B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 23, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Nov 23, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V3/107
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatus according to the invention include inductive units or apparatus such as magnetic metal detectors comprising multiple electromagnetic coils and circuit boards such as electronic printed circuit boards (PCBs) so that the circuit boards, while containing metallic surfaces and layers, are positioned in such a way as to reduce or eliminate their effect on the metal detector's coils. The apparatus comprising: a plurality of electromagnetic coils and a plurality of circuit boards, and wherein at least one of said circuit boards is positioned so that its thickness direction is orthogonal to the magnetic field of at least one of said coils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.