Fabric electronic device housings
US10056205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Mar 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/23
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The fabric may be formed from woven polymer yarn. The fabric may be treated with chemicals to improve stain resistance and wear resistance, may be provided with a polymer backing layer, and may receive molded plastic structures. Patterned areas may be woven into the fabric, may be formed by placing coatings on selected portions of the fabric, or may be formed by embroidering or otherwise locally processing the fabric. The patterned areas may form labels for keyboard keys, logos, key trim patterns, and other features for an electronic device. Patterned areas may have locally enhanced light transmission characteristics and may be backlit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.