Method and system of robot fork calibration and wafer pick-and-place
US10056282B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Feb 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A robot fork calibration method and system is provided. At least three non-linear arranged lower sensors are provided on a bottom surface of the fork to detect distances to a fixed detection point. The fixed detection point and a horizontal plane of the detection point define a reference coordinate system. Spatial coordinates of the lower sensors in the reference coordinate system are calculated and a plane equation as well as a tilted angle of the fork are obtained according to the spatial coordinates. Therefore, the height of the fork can be calibrated according to the Z axis coordinates of the lower sensors and the levelness of the fork can be calibrated according to the tilted angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.