Molded power module having single in-line leads
US10056893B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2016 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2017/0806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module has a lead frame, a first power chip, a second power chip, a plurality of single in-line leads, a gate drive and protection integrated circuit (IC), a plurality of bonding wires and a molding encapsulation. The first and second power chips are attached to a top surface of the lead frame. The plurality of single in-line leads has a high voltage power lead, a low voltage power lead and a plurality of signal control leads. The low voltage power lead has a lead portion and an extension portion. The gate drive and protection IC is attached to the extension portion of the low voltage power lead. The molding encapsulation encloses the first and second power chips, the extension portion of the low voltage power lead, the gate drive and protection IC, the plurality of bonding wires and at least a majority portion of the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.