Patent · US Active

Electronic assemblies and method for manufacturing the same

US10057975B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

ASUSTEK COMPUTER INC. · TW

Inventors

Hank Lin · Taipei, TW
Bin-Chyi Tseng · Taipei, TW
Chung-Han Tsai · Palo Alto, US
Shih-Keng Chuang · Taipei, TW

Key dates

Filing date	Sep 13, 2017
Grant date	Aug 21, 2018
Priority date	—
Expiry date	Sep 13, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10022
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.