Fabrication methods for bio-compatible devices using an etch stop and/or a coating
US10057983B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2014 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Jan 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1377
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method may involve: forming a first bio-compatible layer; forming an etch stop over a portion of the first bio-compatible layer; forming a conductive pattern over the etch stop and the first bio-compatible layer, wherein the conductive pattern defines an antenna, sensor electrodes, electrical contacts, and one or more electrical interconnects; mounting an electronic component to the electrical contacts; forming a second bio-compatible layer over the electronic component, the antenna, the sensor electrodes, the electrical contacts, the one or more electrical interconnects, and the etch stop; and etching, using an etchant, a portion of the second bio-compatible layer to form an opening in the second bio-compatible layer and thereby expose the sensor electrodes, wherein the etch stop inhibits etching of the portion of the first bio-compatible layer by the etchant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.