Patent · US Active

Method for installing integrated circuit devices on a substrate

US10057994B2 · kind B2 · utility

0Cited by

12References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Thomas A. Boyd · Austin, US
Michael Z. Eckblad · Auburn, US

Key dates

Filing date	Dec 18, 2015
Grant date	Aug 21, 2018
Priority date	—
Expiry date	Aug 18, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.