Conductive adhesive layer for gasket assembly
US10058014B1 · kind B1 · utility
2Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | Aug 21, 2018 |
| Priority date | — |
| Expiry date | Dec 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus suitable for EMC shielding applications comprises a first component comprising an electrically conductive first surface, and a gasket member comprising an electrically conductive exterior surface. The exterior surface is configured to couple with an electrically conductive second surface of a second component. The apparatus further comprises an adhesive layer disposed between the first component and the gasket member. The adhesive layer comprises an arrangement of conductive fibers, the conductive fibers extending along respective long axes between the first surface and the exterior surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.