Membrane bonding
US10058892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Aug 23, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Systems and techniques are provided for membrane bonding. A bonding agent may be applied to one or both of an ultrasonic device and membrane. The membrane may be placed on the ultrasonic device such that the membrane is in contact with the ultrasonic device through the bonding agent. The membrane and the ultrasonic device may be placed in between a first flat plate and a second flat plate, such that the second flat plate rests on top of the membrane. Light pressure may be applied to the membrane. The light pressure may be applied by one or more of the weight of the second flat plate and a pressure providing device applying pressure to either or both of the first flat plate and the second flat plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.