Bonding stage and bonding apparatus comprising the same
US10058952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Jan 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75988
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.