Patent · US Active

Method for monitoring and controlling a laser cutting process

US10058953B2 · kind B2 · utility

3Cited by

8References

5Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Tim Hesse · Ditzingen, DE
David Schindhelm · Stuttgart, DE

Key dates

Filing date	Jan 30, 2017
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Jan 30, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K31/125
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.