Patent · US Active

Cold lamination with radiation

US10059088B2 · kind B2 · utility

0Cited by

8References

18Claims

0Family size

Assignee

Lisa Draexlmaier GmbH · DE

Inventors

Wolfgang Fischer · Meerbusch, DE
Stephanie Reisinger · Munich, DE
Robert Magunia · Mosbach, DE

Key dates

Filing date	Sep 17, 2015
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Aug 22, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24628
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process for laminating a material layer to a support including: providing the support, applying the material layer to the support, a heat-activatable adhesive being applied to s side of the material layer facing the dimensionally stable support and/or to the side of the dimensionally stable support facing the material layer, pressing the flexible material layer and the dimensionally stable support together by means of a lower dimensionally stable mold half and an upper dimensionally stable mold half, irradiating the mold halves, the support and the material layer with electromagnetic radiation, in particular with microwave radiation, high-frequency radiation or induction radiation, whereby the adhesive is activated directly or indirectly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.