High modulus epoxy adhesives for shimming applications
US10059862B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2014 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Jun 26, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Use of a curable composition comprising at least one epoxy resin and at least one epoxy curative composition as a curable shim for filling gaps between two assembled parts of an assembly, wherein the epoxy curative composition comprises at least a first and a second curative wherein the first curative is selected from a cyclic amine having at least one primary amino (—NH2) group and a second curative selected from at least one polyether polyamine comprising at least one polyether unit and separated therefrom by a linking group at least one polyamine unit and further comprising at least one terminal aminoalkyl residue that is branched and comprises a primary amino group (—NH2) and an alkyl branch in an α-, β- or γ-position to the primary amino group wherein the alkyl branch contains from 1 to 6 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.