Electrodeposition method for preparing polycrystalline copper having improved mechanical and physical properties

US10060016B2 · kind B2 · utility

Assignee

• Integran Technologies Inc. · KR

Inventors

• Gino Palumbo · Toronto, CA
• Iain Brooks · Toronto, CA
• Klaus Tomantschger · Mississauga, CA
• Peter Lin · Toronto, CA
• Karl Aust · Toronto, CA
• Nandakumar Nagarajan · Burlington, CA
• Francisco Gonzalez · Toronto, CA

Key dates

• Filing date: Jan 21, 2016
• Grant date: Aug 28, 2018
• Expiry date: Jul 9, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D3/12
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Polycrystalline materials are prepared by electrodeposition of a precursor material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fraction of ‘special’ low Σ grain boundaries and a randomized crystallographic texture. The precursor metallic material has sufficient purity and a fine-grained microstructure (e.g., an average grain size of 4 nm to 5 μm). The resulting metallic material is suited to the fabrication of articles requiring high mechanical or physical isotropy and/or resistance to grain boundary-mediated deformation or degradation mechanisms.