Patent · US Active

Electroless copper plating compositions

US10060034B2 · kind B2 · utility

0Cited by

11References

4Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Meng Qi · Beijing, CN
Sze Wei Chum · Sha Tin, CN
Ping Ling Li · Sha Tin, CN

Key dates

Filing date	Jan 23, 2017
Grant date	Aug 28, 2018
Priority date	—
Expiry date	Jan 23, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C18/405
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.