Integrated passive and active seismic surveying using multiple arrays
US10061046B2 · kind B2 · utility
2Cited by
18References
29Claims
0Family size
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Key dates
| Filing date | Feb 5, 2013 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Apr 6, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2210/123
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.