Toolpath planning process for conductive materials
US10061301B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2015 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Dec 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of generating a tool path for an additive manufacturing process, the tool path having an input polygon for a thick region, and an input path for a wire region. The method includes offsetting the input polygon by a minimum step over distance, creating a set of contour parallel offset lines, computing path segments from a medial axis transform of the input polygon, computing a dilation of the medial axis path by a radius approximately half the step over distance, producing a dilated medial axis, clipping the contour parallel offset paths by the medial axis path, producing, and recursively connect the medial axis paths with the clipped contour parallel paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.