Induction coil having a conductive winding formed on a surface of a molded substrate
US10062492B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2014 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02J7/0042
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The following examples and embodiments are directed to an induction coil that can be used in a variety of applications, including, for example, induction charging systems. In one example, an induction coil is configured to couple an electrical field between a base device and a mobile device in an inductive charge system. The induction coil includes a coil substrate formed by a molding process. The induction coil also includes a shield element disposed within the coil substrate. The shield element may be formed within the coil substrate as part of the molding process. A conductive winding is also formed within a surface of the coil substrate. In some cases, the coil substrate is formed by an injection-molding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.