Multilayer electronic component and board having the same
US10062511B1 · kind B1 · utility
15Cited by
1References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2017 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Nov 14, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a capacitor body with first and second external electrodes on a mounting surface of the capacitor body. First and second connection terminals include insulators and are respectively connected to the first and second external electrodes. The first connection terminal includes first to third conductive patterns and a first cut portion a side surface. The second connection terminal includes fourth to sixth conductive patterns and a second cut portion in a side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.