Fan-out semiconductor package and method of manufacturing same
US10062652B2 · kind B2 · utility
6Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Nov 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the semiconductor chip, and a redistribution layer disposed on the other sides of the frame and the semiconductor chip, and a method of manufacturing the same. The first encapsulant and the second encapsulant may include different materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.