Solid-state imaging device, manufacturing method thereof, and camera with arranged pixel combinations alternatively
US10062719B2 · kind B2 · utility
7Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 6, 2017 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Feb 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2209/045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.