Magnetic sensor and method of manufacturing the same
US10062836B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2017 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Mar 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N52/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The magnetic sensor includes a semiconductor substrate having Hall elements on a front surface of the semiconductor substrate, a conductive layer formed on a back surface of the semiconductor substrate, and a magnetic flux converging plate formed on the conductive layer. The magnetic flux converging plate is formed on the back surface of the semiconductor substrate through formation of the base conductive layer on the back surface of the semiconductor substrate, formation of a resist on the base conductive layer having an opening for forming the magnetic flux converging plate, formation of the magnetic flux converging plate in the opening of the resist by electroplating, removal of the resist, and removal of a part of the base conductive layer by etching with the magnetic flux converging plate as a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.