Co-fired passive integrated circuit devices
US10062838B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 14, 2015 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Dec 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/692
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A variety of integrated circuit devices and a method for their formation and integration are provided. The integrated circuit devices may include inductors, capacitors, and/or other passive devices. In an exemplary embodiment, a first substrate is received and a conductive material is applied to the first substrate such that a loop of the conductive material is formed on the first substrate. A magnetic material is applied to the first substrate and surrounds at least a portion of the loop. A thermal process is performed on the first substrate having the conductive material and the magnetic material applied thereupon. The conductive material is bonded to a second substrate, and thereafter, the conductive material and the magnetic material are separated from the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.