Phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods
US10063186B2 · kind B2 · utility
1Cited by
98References
10Claims
0Family size
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Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Aug 6, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E70/30
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present technology is directed generally to phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods. In particular embodiments, a system directs warm air through an airflow path in thermal communication with a phase change material to liquefy the phase change material and cool the air. The system also directs the cool air into thermal communication with electronic components to cool the electronic components via conduction and/or convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.