Ground system for high voltage semiconductor valve
US10064260B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2013 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Aug 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high voltage valve arrangement includes a high voltage valve unit; an external electric shield structure arranged at least partially around the high voltage modular valve unit and a grounding system. The grounding system includes a grounding system configured to be remotely extended from a retracted position to an extended position, whereby the extendable grounding device establishes electric connection with the external shield structure when it is extended from the retracted position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.