Conductive adhesive film and method of attaching electronic device using the same
US10064274B2 · kind B2 · utility
1Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Oct 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive adhesive film includes a first adhesive member including a first insulating adhesive layer having a first viscosity, a plurality of first conductive balls being in the first insulating adhesive layer, and a second adhesive member including a second insulating adhesive layer having a second viscosity greater than the first viscosity, a plurality of second conductive balls being in the second insulating adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.