Integrated passive devices and assemblies including same
US10064277B2 · kind B2 · utility
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42Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 29, 2016 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Jul 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.