Standard form factor electronic module carrier comprising multiple separately-removable sub-carriers
US10064305B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2017 |
| Grant date | Aug 28, 2018 |
| Priority date | — |
| Expiry date | Aug 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module carrier in one embodiment comprises a carrier housing having a front portion and a rear portion, and a plurality of sub-carriers configured for separate insertion into and removal from respective sub-carrier slots in the front portion of the carrier housing. Each of the sub-carriers is configured to support at least one non-volatile memory module. The electronic module carrier is configured with a designated standard form factor for insertion into and removal from a carrier slot in a front portion of an electronic equipment chassis. For example, the standard form factor may be a 2.5″ storage drive form factor. The non-volatile memory modules may comprise respective flash drives or other types of non-volatile memory modules implemented using an M.2 form factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.