Substrate processing method and substrate processing apparatus
US10065218B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Mar 11, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Apr 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solidified body forming step includes: a first step of landing a processing surface of a cooling member on a liquid film to solidify the liquid to be solidified located in an area sandwiched between an upper surface and the processing surface; and a second step of releasing the processing surface from the solidified area solidified in the first step. The processing surface has a lower temperature than a freezing point of the liquid to be solidified. Adhesion between the solidified area and the processing surface is smaller than that between the solidified area and the upper surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.