Joining to aluminum
US10065274B2 · kind B2 · utility
0Cited by
5References
12Claims
0Family size
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Aug 29, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.