Molded resin-equipped electric wire and molded resin-equipped electric wire production method
US10065342B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 1, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/0214
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
When forming molded resin on a terminal-equipped conductive wire, cases where resin inside the mold for insert-molding leaks out from the mold are suppressed. A smooth portion having a smooth outer circumferential surface is formed in a conductive wire of a terminal-equipped conductive wire (smooth portion formation step (S2)). Furthermore, a molded resin member that covers the terminal connection portion is formed in a state where the terminal connection portion provided is inserted into an insert-molding mold, and a portion of the conductive wire that extends from a metal terminal is exposed to the outside through an opening portion of the mold (insert-molding step (S3)). The outer shape of the smooth portion is a shape that corresponds to the opening shape of the opening portion of the mold. In the insert-molding step (S3), the interior of the mold is filled with a resin in a state where the inner circumferential surface of the opening portion of the mold is in contact with the outer circumferential surface of the smooth portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.