Patent · US Active

Systems and methods for separation of thermal interface bond

US10065407B2 · kind B2 · utility

0Cited by

0References

14Claims

0Family size

Assignee

Dell Products L.P. · US

Inventors

Lawrence A. Kyle · Salado, US
Corey Dean Hartman · Hutto, US
Hsu-Chu Wang · Taipei, TW

Key dates

Filing date	Oct 4, 2016
Grant date	Sep 4, 2018
Priority date	—
Expiry date	Nov 16, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1978
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.