Composition for forming conductive pattern and resin structure having conductive pattern
US10065860B2 · kind B2 · utility
1Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2015 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Sep 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.