Tungsten processing slurry with catalyst
US10066126B2 · kind B2 · utility
4Cited by
1References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 6, 2016 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | May 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation catalyst, phosphorus-containing zwitterionic compound, and optional ingredients such as oxidizer; also described are methods and substrates used or processed on combination with the compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.