Single-chip differential free layer push-pull magnetic field sensor bridge and preparation method
US10066940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Sep 25, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/098
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided are a single-chip differential free layer push-pull magnetic field sensor bridge and preparation method, the magnetic field sensor bridge comprising: a substrate, a staggered soft magnetic flux concentrator array, and a GMR spin valve or a TMR magnetoresistance sensing unit array having a magnetic sensing axis in an X-direction on the substrate. A soft magnetic flux concentrator comprises sides parallel to an X-axis and a Y-axis, and four corners sequentially labeled as A, B, C and D clockwise from an upper left position. Magnetoresistive sensing units are located at gaps between the soft magnetic flux concentrators. Additionally, the magnetoresistive sensing units corresponding to the A and C corner positions and B and D corner positions of the soft flux concentrators are defined as push magnetoresistive sensing units and pull magnetoresistive sensing units, respectively. The push magnetoresistive sensing units are electrically interconnected into one or more push arms, and the pull magnetoresistive sensing units are electrically interconnected into one or more pull arms. The push arms and the pull arms are electrically interconnected to form a push-pull sensor bridge. Th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.