Semiconductor device, method of manufacturing a semiconductor device and apparatus for testing a semiconductor device
US10067180B2 · kind B2 · utility
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11References
20Claims
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Inventor
Key dates
| Filing date | Jun 12, 2015 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Jul 13, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided is a semiconductor device including a substrate, insulating layers on the substrate, interconnection lines in or between the insulating layers, and pads on the insulating layers. The pads may include signal pads connected to the interconnection lines, and measurement pads disposed spaced apart from the signal pads and electrically connected to corresponding ones of the signal pads by the interconnection lines. Misalignment of probes contacting the semiconductor device may be detected by detecting a signal communicated between one or more of the measurement pads and the signal pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.